Tata Consultancy Services (TCS) has partnered with Qualcomm to launch the TCS Innovation Lab in Bengaluru.
The lab will focus on co-creating smart and scalable Edge AI solutions using Qualcomm platforms. These will help enterprises adopt software-driven approaches to make their systems more efficient and resilient.
According to an official release, the facility will be part of the Bringing Life to Things Network Lab and is equipped with a 5G private network and advanced IoT infrastructure. It will support rapid prototyping and large-scale deployment of customised solutions in sectors such as healthcare, manufacturing, smart infrastructure, and surveillance.
Savi Soin, senior vice president, India president at Qualcomm, said in the release the collaboration is aimed at bringing “practical, real-time Edge AI solutions to industries that are rapidly evolving.”
He added that the Bengaluru lab will be a space where advanced AI and connectivity tackle real-world challenges, with solutions that are “cost-effective, efficient, scalable, and tailored to the needs of enterprises.”
TCS said it will leverage its software-defined (SDx) approach along with Qualcomm’s Edge AI-enabled chips to create hardware-agnostic, secure, and adaptive systems.
V Rajanna, business group head for technology, software, and services at TCS, said the lab will develop “next-generation solutions for diverse applications, including intelligent medical devices, smart industrial handhelds, and advanced safety and surveillance systems.”
Regu Ayyaswamy, global head of IoT and digital engineering at TCS, said in the release that combining SDx with Qualcomm’s platforms will create adaptive, scalable, and sustainable industry solutions.
TCS noted that the lab builds on earlier large-scale projects carried out jointly with Qualcomm in silicon design and IT services. It added that SDx capabilities also enable smart networks with intelligent controls, device prognostics, and AI-enabled automation to support the shift to next-generation digital infrastructure.
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