Qualcomm Technologies, Inc., at the Mobile World Congress (MWC) Barcelona, unveiled a new tools that will allow developers run AI models on their devices. Qualcomm AI Hub offers 75+ optimized AI models for Snapdragon and Qualcomm platforms, reducing time-to-market for developers and unlocking the benefits of on-device AI for their apps.
These models are also available on Hugging Face and GitHub. Developers will be able run the models themselves with a few lines of code on cloud-hosted devices powered by Qualcomm platforms.
“With Snapdragon 8 Gen 3 for smartphones and Snapdragon X Elite for PCs, we sparked commercialisation of on-device AI at scale. Now with the Qualcomm AI Hub, we will empower developers to fully harness the potential of these cutting-edge technologies and create captivating AI-enabled apps,” said Durga Malladi, senior vice president and general manager, technology planning and edge solutions, Qualcomm Technologies, Inc.
“The Qualcomm AI Hub provides developers with a comprehensive AI model library to quickly and easily integrate pre-optimized AI models into their applications, leading to faster, more reliable and private user experiences,” Malladi added.
Moreover, Qualcomm AI Research demonstrated a large multimodal model and customisation of large vision models running on Android smartphones and Windows PCs.
For the first time running on an Android smartphone, Qualcomm AI Research also demonstrated how a Large Language and Vision Assistant (LLaVA), a 7+ billion parameter large multimodal model (LMM) that can accept multiple types of data inputs, including text and images, and generate multi-turn conversations with an AI assistant about an image, can run on an Android phone.
This LMM runs at a responsive token rate on device, which results in enhanced privacy, reliability, personalization, and cost. LMMs with language understanding and visual comprehension enable many use cases, such as identifying and discussing complex visual patterns, objects, and scenes.
The company also unveiled the Qualcomm® FastConnect
7900 Mobile Connectivity system, the first to deliver AI-optimised performance and integrate Wi-Fi 7, Bluetooth, and Ultra Wideband technologies in a single chip. Utilising AI, FastConnect 7900 adapts to specific use cases and environments, delivering meaningful optimizations across power consumption, network latency and throughput.
FastConnect 7900 integrates Ultra Wideband technology, Wi-Fi Ranging, and Bluetooth Channel Sounding to create a powerful suite of proximity technologies that enable security rich device discovery, access, and control.
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